RAM Innovations Ltd Announces $18.3 Million in Funding to Propel Semiconductor and Electronics Industry Services Growth

RAM Innovations Ltd, a pioneer in providing R&D and manufacturing services to the semiconductor and electronics industries, has successfully raised $18,300,000 in a recent funding round. This investment is a significant milestone for the company, which has established itself as a leader in Heterogeneous PCB embedded die packaging (EDP) and continues to support cutting-edge semiconductor development through strategic collaborations. The newly secured funds will be allocated towards expanding RAM’s innovative capabilities, enhancing its existing range of services—including flip chip, die placement and bonding, chemical processing, and plating—while also accelerating the development of embedded power modules. This capital influx is expected to bolster RAM Innovations' commitment to delivering advanced technology solutions that meet the increasingly complex demands of the semiconductor sector. The company is not only focused on its technological advancements but is also pursuing growth through talent acquisition, consistently searching for skilled professionals who can contribute to its dynamic team. Interested candidates are encouraged to send in their CVs, while recruitment agencies are advised to discuss agreements beforehand. This funding marks an exciting time for RAM Innovations Ltd, as it sets the stage for further innovation and expansion within the semiconductor industry, positioning itself at the forefront of technological change and development.